Advanced Electronic Packaging

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dc.contributor.authorUniversiti Malaysia Perlis (UniMAP)
dc.date.accessioned2026-04-10T04:56:33Z
dc.date.issued2025-07
dc.formatpdf
dc.format.extent7 pages
dc.identifier.urihttps://hdl.handle.net/20.500.14860/134918
dc.language.isoen
dc.publisherUniversiti Malaysia Perlis (UniMAP)
dc.relation.ispartofseriesKMJ40803; Semester 2 2024/2025
dc.subjectExamination paper
dc.subjectKMJ40803 -- Test
dc.subjectAdvanced Electronic Packaging -- Examination paper
dc.subjectPembungkusan Elektronik Termaju -- Examination paper
dc.subject.lcshTECHNOLOGY::Chemical engineering
dc.titleAdvanced Electronic Packaging
dc.title.alternativePembungkusan Elektronik Termaju
dc.typeLearning Object

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